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| HKT100***F/HKT100Y01F -Chip (RFID) REJ03P0002-0100 Rev.1.00 Feb 16, 2006 Overview * HKT100***F/HKT100Y01F is RFID (Radio Frequency Identification) for 2.45 GHz. * It has a unique ID inside, then it is applicable for management of individual object. Note: "***" or "Y01" is a ROM code. Feature * * * * Thin and small package: COA (Chip on Aluminum) Including unique -Chip ID which is not alterable Including a unique ID Communication without contact Note: "-Chip" and the -Chip Logo are either registered Trademarks or Trademarks of Hitachi,Ltd. in Japan and in other countries. Rev.1.00 Feb 16, 2006 page 1 of 9 HKT100***F/HKT100Y01F Order Type Name Order Type Name HKT100***F HKT100Y01F Unit of Packaging 8,000 min 10,000 Packing Form Reel Reel Unit of Order 75,000 10,000 Note Outline and Mark Outline Mark First three digits indicate ROM code. Rev.1.00 Feb 16, 2006 page 2 of 9 HKT100***F/HKT100Y01F Absolute Maximum Ratings Item Storage temperature Ambient operation temperature Received power Symbol Tstg Ta Pr Specification Min -30 0 -- Typ -- 25 -- Max 75 40 13.8 Unit C C dBm No condensation Condition Remark Electrical Characteristics Measurement conditions: Unless otherwise specified, Ta = 25C, fc = 2.416 0.010 GHz, reader power = 150 mW Single-patch antenna, linearity polarized waves, clock cycle = 10 s, clock duty cycle = 85% Period of reading operations: 8 clock cycles, number of read bits: 128 bits Item Communication distance -Chip ID Check Notes: 1. 2. 3. 4. Specification Min 6 -- Typ -- Passed Max 15 -- Unit cm -- Condition Note4 Note1 Note2, Note3 Remark EDC Check The distance at which the read -Chip ID value matches the indicated value and the EDC check is passed. Verification value calculated from the read -Chip ID value. Detail data of -Chip ID is describe on the commodity specification. Relation between the inlet and antenna positions; The planes of the copper-foil pattern for the antenna and the antenna itself should be parallel, the center of the inlet should be on the line that passes through the center of the antenna plane, and the inlet copper-foil pattern's longer side should be within the antenna's plane of polarization. Reader Specifications and Type No.: MR-STD2 Item Operation temperature Carrier frequency Power Clock cycle Clock duty ratio Data read cycle Data read bit count Symbol Ta fc Pw Tclk duty Tfm Nb Specification 25 2.416 0.010 150 10 85 8 128 Unit C GHz mW s % Clock Bits Remarks Cable Specifications Item Cable material Total length of cable Symbol -- L Specification semi-rigid 20 Unit -- cm Remarks Antenna Specifications and Type No.: PA1-2450AS Item Operation temperature Polarization Number of patches Gain Symbol Ta -- -- -- Specification 25 Linear 1 7 Unit C -- pcs dBi Remarks Rev.1.00 Feb 16, 2006 page 3 of 9 HKT100***F/HKT100Y01F Dimension of Inlet Outline Tape Dimensions The products, each of which consists of an antenna and chip, are aligned and mounted on tape as shown in the figure below. The chip-mounting section is punched through if the chip is defective. 70.0 0.6 51.5 0.25 Antenna All dimensions: mm 2.375 0.05 Recognition mark: " " (square) type 1.5 Recognition mark: " " (cross) type 28.0 1.5 Section A 1.5 0.25 30.0 34.4 Note: Dimensional tolerance is 0.2 mm unless otherwise specified. Details for Section A Chip-mounting section (Area of sealant coverage is less than 1.5 mm) Punched hole for defective part: 2.0 mm (Typ) Deformations that require punching twice or more are passed over Rev.1.00 Feb 16, 2006 page 4 of 9 HKT100***F/HKT100Y01F Leader and Trailer Sections This product includes leader and trailer sections that precede and follow the product section, i.e. the section that carries the chips, as shown in the figure below. Splicing tape (polyester) Thickness: 0.055 mm All dimensions: mm 2000 200 Leader section (PET) Punched hole for defective part 10.0 0.5 a) First Part Unwound 2000 200 Splicing tape (polyester) Thickness: 0.055 mm Trailer section (PET) 10.0 0.5 Punched hole for defective part b) Final Part Unwound Punched Holes for Defective Part Chips of defective parts will be punched through with the hole size of 2.0 mm. Rev.1.00 Feb 16, 2006 page 5 of 9 HKT100***F/HKT100Y01F Jointed Segments of Tape This product may include splices, where two tapes are pasted together, as shown below. The number of splices is no more than 5 per reel (excluding the attachment of leader/trailer tapes Note). Products covered by the splicing tape will be punched through as defective parts. A Splicing tape (polyester) Thickness: 0.055 mm Punched hole for defective part B D C Tape on both sides Dimension A B C D Description The antenna pitch at spliced part Misalignment at spliced point Splicing tape width Overflow of splicing tape Specification 2.375 0.2 mm 0.2 mm 10.0 0.5 mm < 0.5 mm Note: If leader/trailer parts are broken or spoiled by creases, the tape will be cut and jointed again. The attachment of leader/trailer will not be punched through as defective parts. Rev.1.00 Feb 16, 2006 page 6 of 9 HKT100***F/HKT100Y01F Packing Specifications Packing Specifications and Quantity (1) As shipped, this product is packed in reel. (2) Quantity is 8,000 good pieces/reel Min.Note However, quantity of HKT100Y01F is 10,000 good pieces/reel. (3) Quantity of punched hole for defective part is 10% or less of total quantity of antenna. Note: Tapes can be joined to increase the quantity. Example of Labeling (9) (1) (2) (3) (4) (5) (6) P I D 05480P10CV-001 D / N RKZ6.8TKJR1 QTY 8000 SPN RKZ6.8TKJR1 ZZZZ WP MADE IN JAPAN AS MADE IN JAPAN T/C 0548 FL90030E0 S.LOT FL90030E0 Pb-Free T. 2005/11/23 (10) (7) (8) Notes: (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) Pack-ID Device Name Quantity SAP Name Country of Wafer Process Country of Assembly (Japan MADE IN JAPAN / Malaysia MADE IN MALAYSIA) Trace code Lot code Pb-Free indication (Only for Pb-free product) Date of Label issuance Rev.1.00 Feb 16, 2006 page 7 of 9 HKT100***F/HKT100Y01F Form of Delivery (1) Paper tape for spacers Paper tape is inserted as a spacer for the product tape. When wound onto the reel, the product tape is oriented so that the antenna face is on the inner side. All dimensions: mm Paper tape 22 16 71 22 Leader 0.183 Reel 0.08 Antenna face is the inner side Product-tape winding direction Paper tape (material: kraft paper) (2) Packing and reel dimensions 1.6 0.5 72 0.6 All dimensions: mm 76.2 0.6 200 1.5 Material: cardboard External View of the Reel Label (On reel) Label (On bag) Antistatic bag Cellophane tape Inner packing box Packing Form Rev.1.00 Feb 16, 2006 page 8 of 9 HKT100***F/HKT100Y01F Appearance There should not be any scratch or/and dirt that affect characteristics. Quality Level (Compliant with the JIS Z 9015) Electrical characteristics: AQL = 4.0% Appearance: AQL = 4.0% Precautions on Usage 1. Renesas Technology does not guarantee the product characteristics after it has been through assembly on the customer side. 2. Please refer to the mounting manual. (Document No.: REJ11P0002-0100) System Outline -Chip Inlet -Chip Supply voltage / modulator Logic circuit Reader Reset circuit Clock demodulator 128-bit ROM Antenna Function Blocks Block Name Supply voltage/modulator Description of Functions Generates power-supply voltage from carrier signals, varies the output impedance of the modulator circuit to match the input impedance of the antenna, and handles communications. The IC incorporates a power limiter for the protection of internal devices. Determines whether or not a clock signal is being supplied and cancels the reset mode in synchronization with the first clock cycle. Demodulates the clock signal from the envelope signal of the received signal. The IC includes an on-chip 128-bit ROM from which data signals are sent out in synchronization with the clock signal. Reset circuit Clock demodulator Logic circuit Rev.1.00 Feb 16, 2006 page 9 of 9 Sales Strategic Planning Div. Keep safety first in your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145 http://www.renesas.com Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510 (c) 2006. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .6.0 |
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